Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6783611 | Phosphorized copper anode for electroplating | Kenji Yajima, Hideyuki Ikenoya | 2004-08-31 |
| 6640876 | Method and apparatus for manufacturing copper and/or copper alloy ingot having no shrinkage cavity and having smooth surface without wrinkles | Kenji Yajima, Norikazu Ishida, Yutaka Koshiba, Keiji Nogami | 2003-11-04 |