YK

Yoshirou Kuromitsu

MM Mitsubishi Materials: 34 patents #6 of 1,543Top 1%
MM Mitsubishi Metal: 3 patents #9 of 150Top 6%
TT The University Of Tokyo: 1 patents #1,000 of 2,633Top 40%
LG: 1 patents #17,402 of 26,165Top 70%
Samsung: 1 patents #49,284 of 75,807Top 70%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
Overall (All Time): #89,886 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
7138350 MgO vapor deposition material and method for preparation thereof Hideaki Sakurai, Ginjiro Toyoguchi 2006-11-21
6995104 Polycrystalline MgO deposition material having adjusted Si concentration Eung Chul Park, Hideaki Sakurai, Ginjiro Toyoguchi 2006-02-07
6965125 Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film Hideaki Sakurai 2005-11-15
6872115 Blade with comb teeth coated with a compound layer for forming ribs and its production method Hideaki Sakurai, Kunio Sugamura, Yoshio Kanda, Ryuji Uesugi, Young-Cheul Kang +5 more 2005-03-29
6828588 Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film Hideaki Sakurai 2004-12-07
6821616 Protective thin film for FPDS, method for producing said thin film and FPDS using said thin film Hideaki Sakurai, Yukiya Yamashita 2004-11-23
6033787 Ceramic circuit board with heat sink Toshiyuki Nagase, Kunio Sugamura, Yoshio Kanda, Masafumi Hatsushika, Masato Otsuki 2000-03-07
5780162 Aluminum nitride substrate and method of producing the same Seiji Toyoda, Kunio Sugamura, Akira Nakabayashi 1998-07-14
5213877 Ceramic substrate used for fabricating electric or electronic circuit Hideaki Yoshida, Makoto Toriumi, Hirokazu Tanaka, Masao Umezawa, Michio Yuzawa 1993-05-25
5130498 Ceramic substrate used for fabricating electric or electronic circuit Hideaki Yoshida, Makoto Toriumi, Michio Yuzawa 1992-07-14
5096768 Substrate used for fabrication of thick film circuit Hideaki Yoshida, Toshiyuki Nagase, Hiroto Uchida, Tadaharu Tanaka, Yoshio Kanda +1 more 1992-03-17
5087509 Substrate used for fabrication of thick film circuit Hideaki Yoshida, Toshiyuki Nagase, Tadaharu Tanaka, Yoshio Kanda 1992-02-11