Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11268214 | Filament for material extrusion 3D printer molding and production method of molded body | Toshihisa Ishihara, Shigeyuki Furomoto | 2022-03-08 |
| 9682362 | Process for producing water-absorbing polyacrylic acid (salt) resin | Makoto Nagasawa, Yoshiki Katada, Kunihiko Ishizaki | 2017-06-20 |
| 6302772 | Apparatus and method for dressing a wafer polishing pad | Kanji Hosoki, Hiroshi Shibaya, Masahito Komasaki, Hiroyuki Kobayashi | 2001-10-16 |
| 6280306 | Wafer polishing apparatus and wafer manufacturing method | Kanji Hosoki, Hiroshi Shibaya, Masahito Komasaki, Kazuo Iizuka | 2001-08-28 |