Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7037732 | Method and device for cutting wire formed on semiconductor substrate | Yukio Maruta | 2006-05-02 |
| 4224243 | Process for producing dimethyl formamide | Tetsuo Aoyama, Shigeru Horie, Kozo Sano, Hidetaka Kiga, Takeo Ikarashi | 1980-09-23 |
| 4218398 | Process for producing dimethylformamide | Masao Saito, Yuzi Onda, Tetsuo Aoyama, Kumiko Kato | 1980-08-19 |