Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322430 | Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin | Hodaka ROKUBUICHI, Kuniyuki Sato, Kiyofumi Kitai | 2022-05-03 |
| 11152280 | Semiconductor device and method for manufacturing the same | Dai Nakajima, Haruna Tada, Hodaka ROKUBUICHI, Kiyofumi Kitai | 2021-10-19 |
| 11049787 | Semiconductor device and method of manufacturing the same | Haruna Tada, Dai Nakajima | 2021-06-29 |
| 10775329 | Thermal conductivity measurement device and thermal conductivity measurement method | Haruna Tada, Dai Nakajima | 2020-09-15 |
| 10768127 | Thermal conductivity measurement apparatus and thermal conductivity measurement method | Dai Nakajima, Haruna Tada | 2020-09-08 |
| 9892992 | Swaged heat sink and heat sink integrated power module | Dai Nakajima, Hiroyuki Yoshihara, Kiyofumi Kitai, Kiyoshi Shibata | 2018-02-13 |