Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322430 | Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin | Hodaka ROKUBUICHI, Kuniyuki Sato, Yasuyuki SANDA | 2022-05-03 |
| 11152280 | Semiconductor device and method for manufacturing the same | Yasuyuki SANDA, Dai Nakajima, Haruna Tada, Hodaka ROKUBUICHI | 2021-10-19 |
| 10529643 | Semiconductor device and method of manufacturing the same | Kei Yamamoto, Hodaka ROKUBUICHI, Dai Nakajima, Yoichi Goto | 2020-01-07 |
| 10461010 | Power module, power semiconductor device and power module manufacturing method | Hiroyuki Yoshihara, Dai Nakajima, Masaki Goto | 2019-10-29 |
| 9892992 | Swaged heat sink and heat sink integrated power module | Yasuyuki SANDA, Dai Nakajima, Hiroyuki Yoshihara, Kiyoshi Shibata | 2018-02-13 |
| 9685399 | Power semiconductor device | Toru Kimura, Yoichi Goto | 2017-06-20 |
| 8643171 | Power semiconductor device | Shigeyuki Nakazato, Yoichi Goto, Toru Kimura | 2014-02-04 |