Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6224810 | Method of plastic molding | — | 2001-05-01 |
| 5662848 | Plastic molding method for semiconductor devices | Sueyoshi Tanaka, Zyunzi Sakakibara | 1997-09-02 |
| 5375989 | Apparatus for plastic encapsulation of a semiconductor element | — | 1994-12-27 |
| 5366364 | Plastic molding apparatus | Sueyoshi Tanaka, Zyunzi Sakakibara | 1994-11-22 |
| 5336272 | Method for molding a semiconductor package on a continuous leadframe | Sueyoshi Tanaka | 1994-08-09 |
| 5281121 | Resin sealing apparatus | Sueyoshi Tanaka, Yutaka Morita | 1994-01-25 |
| 5134458 | Long size lead frame for semiconductor elements | Sueyoshi Tanaka | 1992-07-28 |
| 5108278 | Resin sealing apparatus | Sueyoshi Tanaka, Yutaka Morita | 1992-04-28 |
| 5074779 | Mold for resin-sealing a semiconductor device | Sueyoshi Tanaka | 1991-12-24 |
| 5059379 | Method of resin sealing semiconductor devices | Sueyoshi Tanaka, Tatsuro Takahashi, Yutaka Morita, Hideaki Seuzaki, Hiromichi Yamada | 1991-10-22 |
| 4983111 | Device for resin sealing semiconductor devices | Sueyoshi Tanaka, Tatsuro Takahashi, Yutaka Morita, Hideaki Suezaki, Hiromichi Yamada | 1991-01-08 |
| 4915608 | Device for resin sealing semiconductor devices | Sueyoshi Tanaka, Tatsuro Takahashi, Yutaka Morita, Hideaki Suezaki, Hiromichi Yamada | 1990-04-10 |