Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5662848 | Plastic molding method for semiconductor devices | Zyunzi Sakakibara, Yasutsugu Tsutsumi | 1997-09-02 |
| 5366364 | Plastic molding apparatus | Zyunzi Sakakibara, Yasutsugu Tsutsumi | 1994-11-22 |
| 5336272 | Method for molding a semiconductor package on a continuous leadframe | Yasutsugu Tsutsumi | 1994-08-09 |
| 5281121 | Resin sealing apparatus | Yasutsugu Tsutsumi, Yutaka Morita | 1994-01-25 |
| 5134458 | Long size lead frame for semiconductor elements | Yasutsugu Tsutsumi | 1992-07-28 |
| 5108278 | Resin sealing apparatus | Yasutsugu Tsutsumi, Yutaka Morita | 1992-04-28 |
| 5074779 | Mold for resin-sealing a semiconductor device | Yasutsugu Tsutsumi | 1991-12-24 |
| 5059379 | Method of resin sealing semiconductor devices | Yasutsugu Tsutsumi, Tatsuro Takahashi, Yutaka Morita, Hideaki Seuzaki, Hiromichi Yamada | 1991-10-22 |
| 4983111 | Device for resin sealing semiconductor devices | Yasutsugu Tsutsumi, Tatsuro Takahashi, Yutaka Morita, Hideaki Suezaki, Hiromichi Yamada | 1991-01-08 |
| 4915608 | Device for resin sealing semiconductor devices | Yasutsugu Tsutsumi, Tatsuro Takahashi, Yutaka Morita, Hideaki Suezaki, Hiromichi Yamada | 1990-04-10 |