Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664127 | Method of manufacturing multi-layer printed wiring board | Seiji Oka, Satoshi Yanaura, Takeshi Muraki | 2003-12-16 |
| 6451710 | Method of manufacturing multi-layer printed wiring board | Seiji Oka, Satoshi Yanaura, Takeshi Muraki | 2002-09-17 |