Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892203 | Power semiconductor module | — | 2021-01-12 |
| 7100275 | Method of producing a multi-layered wiring board | Toshiyuki Toyoshima, Yasuo Furuhashi, Hirofumi Fujioka | 2006-09-05 |
| 6700073 | Semiconductor device | Seiki Hiramatsu, Masuo Koga, Hirofumi Fujioka | 2004-03-02 |
| 6664127 | Method of manufacturing multi-layer printed wiring board | Seiji Oka, Yasuo Kawashima, Takeshi Muraki | 2003-12-16 |
| 6451710 | Method of manufacturing multi-layer printed wiring board | Seiji Oka, Yasuo Kawashima, Takeshi Muraki | 2002-09-17 |
| 5276414 | Moistureproof structure for module circuits | Takamitsu Fujimoto, Atsuko Noda, Takeji Fujiwara, Hiroyuki Sato, Fumiaki Baba | 1994-01-04 |
| 4985794 | Rotary drum device having a head drive with positively bonded bobbin fixing members | Naoki Kato, Toshiro Tsukahara, Kousuke Haraga | 1991-01-15 |