Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6347655 | Die bonding device and semiconductor device | Masahiko Yamamoto, Toshio Komemura | 2002-02-19 |
| 6320259 | Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor device | Shunji Yamauchi | 2001-11-20 |
| 5291059 | Resin-molded semiconductor device and lead frame employed for fabricating the same | Kazuyuki Hayashi | 1994-03-01 |