Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033905 | Semiconductor device and method for manufacturing the same | Takayuki Hisaka | 2024-07-09 |
| 11244874 | Substrate bonding structure and substrate bonding method | — | 2022-02-08 |
| 10950567 | Hollow sealed device and manufacturing method therefor | — | 2021-03-16 |
| 10854523 | Semiconductor device | Yoshitsugu Yamamoto, Katsumi Miyawaki, Shinsuke Watanabe, Toshihiko Shiga | 2020-12-01 |
| 10304730 | Semiconductor device having a Pd-containing adhesion layer | — | 2019-05-28 |
| 10224294 | Semiconductor device | Takayuki Hisaka | 2019-03-05 |
| 10020246 | Semiconductor device | Koichiro Hori | 2018-07-10 |
| 9922836 | Semiconductor device manufacturing method and semiconductor device | Akira KIYOI | 2018-03-20 |
| 9887131 | Semiconductor device having a Pd-containing adhesion layer | — | 2018-02-06 |
| 9887284 | Semiconductor device | Shinsuke Watanabe | 2018-02-06 |
| 9576845 | Method for manufacturing a semiconductor device including a hollow structure around an electrode of a semiconductor element | Kazuhiro Maeda | 2017-02-21 |
| 9048295 | Method of manufacturing semiconductor device | Daisuke Tsunami | 2015-06-02 |
| 8766445 | Semiconductor device | Takayuki Hisaka, Takahiro Nakamoto, Toshihiko Shiga | 2014-07-01 |
| 8728939 | Method for manufacturing semiconductor device and semiconductor manufacturing system | Kazuhiro Maeda | 2014-05-20 |
| 8581411 | Semiconductor device | — | 2013-11-12 |
| 8158507 | Method for manufacturing semiconductor device | — | 2012-04-17 |