Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9616530 | Heat exchanger tube inserting apparatus | Takuya Kondou, Tomonari Sera, Takayuki Takahashi, Yoshikazu Tanaka | 2017-04-11 |
| 8304899 | Element wafer and method for manufacturing the same | Mika Okumura, Makio Horikawa, Yasuo Yamaguchi | 2012-11-06 |
| 7802612 | Die casting mold and method of manufacturing and casting the same | Hiroshi Yoshii, Takayoshi Inamura | 2010-09-28 |
| 7533570 | Electrostatic-capacitance-type acceleration sensor | Yasuo Yamaguchi, Makio Horikawa, Mika Okumura | 2009-05-19 |
| 7495301 | Thin film accelerometer | Mika Okumura, Makio Horikawa | 2009-02-24 |
| 7094620 | Semiconductor device manufacturing method | Mika Okumura, Makio Horikawa | 2006-08-22 |
| 5335550 | Semiconductor pressure sensor including multiple silicon substrates bonded together and method of producing the same | — | 1994-08-09 |