Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11618111 | Method of manufacturing plate-shaped solder and manufacturing device | Shuji Uozumi | 2023-04-04 |
| 11213921 | Device for manufacturing plate solder and method for manufacturing plate solder | Shuji Uozumi | 2022-01-04 |
| 11031357 | Semiconductor device | Tetsuo Takahashi, Masayoshi Tarutani, Kenji Harada, Masao TAKATA, Kouichi In | 2021-06-08 |
| 10903147 | Semiconductor device | — | 2021-01-26 |
| 10756029 | Semiconductor device | Tetsuo Takahashi, Masayoshi Tarutani, Kenji Harada, Masao TAKATA, Kouichi In | 2020-08-25 |
| 10658271 | Die pad including projections | — | 2020-05-19 |
| 10290563 | Semiconductor device including die pad with projections | — | 2019-05-14 |