Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864329 | Packaging structure with embedded electronic components and method for manufacturing the same | Chih-Chieh Fu, YUAN-YU LIN | 2024-01-02 |
| 11165668 | Quality assessment and decision recommendation for continuous deployment of cloud infrastructure components | Ken-Hsien Hsieh, Pankaj Kumar Singh, Sree Krishna Chaitanya Vadrevu, Murali Mohan Chintalapati, Yingnong Dang | 2021-11-02 |
| 10382292 | Quality assessment and decision recommendation for continuous deployment of cloud infrastructure components | Ken-Hsien Hsieh, Pankaj Kumar Singh, Sree Krishna Chaitanya Vadrevu, Murali Mohan Chintalapati, Yingnong Dang | 2019-08-13 |