Issued Patents All Time
Showing 126–150 of 212 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256367 | Ultrathin solid state dies and methods of manufacturing the same | Martin F. Schubert | 2019-04-09 |
| 10249806 | Solid state optoelectronic device with preformed metal support substrate | — | 2019-04-02 |
| 10242970 | Discontinuous patterned bonds for semiconductor devices and associated systems and methods | Scott D. Schellhammer, Jeremy S. Frei | 2019-03-26 |
| 10230035 | Light emitting diode package having series connected LEDs | — | 2019-03-12 |
| 10211185 | High efficiency chip-on-board light-emitting diode | Peng Chen, Zhengqing Gan | 2019-02-19 |
| 10204778 | Method and system for vertical power devices | Dilip Risbud, Ozgur Aktas | 2019-02-12 |
| 10205069 | LED array package | Scott West, Cem Basceri, Zhengqing Gan | 2019-02-12 |
| 10181419 | Vertical semiconductor diode manufactured with an engineered substrate | Dilip Risbud, Ozgur Aktas, Cem Basceri | 2019-01-15 |
| 10170668 | Solid state lighting devices with improved current spreading and light extraction and associated methods | Martin F. Schubert | 2019-01-01 |
| 10145522 | Linear LED module | — | 2018-12-04 |
| 10141371 | Wide band gap device integrated circuit device | Cem Basceri | 2018-11-27 |
| 10134589 | Polycrystalline ceramic substrate and method of manufacture | Cem Basceri, Shari Farrens | 2018-11-20 |
| 10134969 | Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods | Martin F. Schubert | 2018-11-20 |
| 10103290 | Ultrathin solid state dies and methods of manufacturing the same | Martin F. Schubert | 2018-10-16 |
| 10096748 | Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods | Martin F. Schubert | 2018-10-09 |
| 10074567 | Method and system for vertical integration of elemental and compound semiconductors | Cem Basceri, Shari Farrens | 2018-09-11 |
| 10066792 | Serial and parallel LED configurations for linear lighting modules | Jesus Del Castillo | 2018-09-04 |
| 10020432 | Etched trenches in bond materials for die singulation, and associated systems and methods | Scott D. Schellhammer, Jeremy S. Frei | 2018-07-10 |
| 10008647 | Wafer-level solid state transducer packaging transducers including separators and associated systems and methods | — | 2018-06-26 |
| 9997662 | Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods | Martin F. Schubert | 2018-06-12 |
| 9997391 | Lift off process for chip scale package solid state devices on engineered substrate | Cem Basceri | 2018-06-12 |
| 9985170 | Flip chip light emitting diode having transparent material with surface features | — | 2018-05-29 |
| 9985183 | Solid state lighting devices with accessible electrodes and methods of manufacturing | Martin F. Schubert | 2018-05-29 |
| 9978807 | Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods | Martin F. Schubert | 2018-05-22 |
| 9978724 | Red flip chip light emitting diode, package, and method of making the same | — | 2018-05-22 |