Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7354795 | Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates | Teck Kheng Lee | 2008-04-08 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates | Teck Kheng Lee | 2007-07-31 |
| 7190081 | Mold gates and tape substrates including the mold gates | Teck Kheng Lee | 2007-03-13 |
| 7057297 | Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods | Teck Kheng Lee | 2006-06-06 |