Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5317006 | Cylindrical magnetron sputtering system | — | 1994-05-31 |
| 5312514 | Method of making a field emitter device using randomly located nuclei as an etch mask | — | 1994-05-17 |
| 5290732 | Process for making semiconductor electrode bumps by metal cluster ion deposition and etching | Chenggang Xie, Rama R. Goruganthu, Mohammed K. Ghazi | 1994-03-01 |
| 5254493 | Method of fabricating integrated resistors in high density substrates | — | 1993-10-19 |
| 5244538 | Method of patterning metal on a substrate using direct-write deposition of a mask | — | 1993-09-14 |
| 5229358 | Method and apparatus for fabricating superconducting wire | — | 1993-07-20 |
| 5227013 | Forming via holes in a multilevel substrate in a single step | — | 1993-07-13 |
| 5199918 | Method of forming field emitter device with diamond emission tips | — | 1993-04-06 |
| 5196102 | Method and apparatus for applying a compound of a metal and a gas onto a surface | — | 1993-03-23 |
| 5178743 | Cylindrical magnetron sputtering system | — | 1993-01-12 |
| 5164332 | Diffusion barrier for copper features | — | 1992-11-17 |
| 5156997 | Method of making semiconductor bonding bumps using metal cluster ion deposition | Rama R. Goruganthu, Mohammed K. Ghazi | 1992-10-20 |
| 5120572 | Method of fabricating electrical components in high density substrates | — | 1992-06-09 |
| 5118385 | Multilayer electrical interconnect fabrication with few process steps | Charles W. C. Lin | 1992-06-02 |