Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5462217 | High force compression flip chip bonding system | Richard L. Simmons | 1995-10-31 |
| 5368217 | High force compression flip chip bonding method and system | Richard L. Simmons | 1994-11-29 |
| 5283946 | Method and apparatus for forming metal leads | Richard L. Simmons, James Wehrly | 1994-02-08 |
| 5210936 | Method and apparatus for the excise and lead form of TAB devices | Richard L. Simmons, James Wehrly | 1993-05-18 |
| 5072874 | Method and apparatus for using desoldering material | Daniel M. Andrews, Thomas Alan Bishop | 1991-12-17 |
| 4945954 | Method and apparatus for aligning mating form tools | James Wehrly | 1990-08-07 |
| 4934582 | Method and apparatus for removing solder mounted electronic components | Daniel M. Andrews | 1990-06-19 |