| 5072874 |
Method and apparatus for using desoldering material |
Michael J. Bertram, Thomas Alan Bishop |
1991-12-17 |
| 5029747 |
Apparatus for replacing defective electronic components |
Alexander J. Russo, Gregory E. Pitts |
1991-07-09 |
| 4991286 |
Method for replacing defective electronic components |
Alexander J. Russo, Gregory E. Pitts |
1991-02-12 |
| 4934582 |
Method and apparatus for removing solder mounted electronic components |
Michael J. Bertram |
1990-06-19 |
| 4852250 |
Hermetically sealed package having an electronic component and method of making |
— |
1989-08-01 |
| 4845335 |
Laser Bonding apparatus and method |
Philip J. Spletter, Richard L. Simmons |
1989-07-04 |
| 4776509 |
Single point bonding method and apparatus |
Gregory E. Pitts, David E. Boone |
1988-10-11 |
| 4278991 |
IC Package with heat sink and minimal cross-sectional area |
Ronald J. Ritchie |
1981-07-14 |