Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12269924 | Polyimide film and manufacturing method thereof | Bo-Hung Lai, Wei Tang | 2025-04-08 |
| 12264249 | Curable composition for inkjet, cured product and flexible printed circuit board | Bo-Hung Lai, Yu-Chiao Shih | 2025-04-01 |
| 12091767 | Laminate and preparing method thereof | Bo-Hung Lai | 2024-09-17 |
| 11442201 | Flexible display cover substrate | Bo-Hung Lai, Chih-Te Yen | 2022-09-13 |
| 11359093 | Polyimide film and flexible display device cover substrate using the same | Bo-Hung Lai, Chih-Te Yen | 2022-06-14 |
| 10995243 | Adhesive composition, adhesive comprising the same, and cured product thereof | — | 2021-05-04 |
| 10953641 | Thermally conductive type polyimide substrate | Po-Cheng Chen | 2021-03-23 |
| 10815389 | Photosensitive and via-forming circuit board | — | 2020-10-27 |
| 10743418 | Thinned flexible polyimide substrate and method for manufacturing the same | — | 2020-08-11 |
| 10584209 | Photosensitive polyimide resin composition and method of manufacturing cover film using the same | Kunhan Hsieh | 2020-03-10 |
| 10538626 | Polyimide resin, thin film and method for manufacturing thereof | Bo-Hung Lai, Wei-Ming Hou | 2020-01-21 |
| 10407549 | Photosensitive polyimide resin composition and method of manufacturing cover film using the same | Kunhan Hsieh | 2019-09-10 |
| 10412836 | Thinned flexible polyimide substrate and method for manufacturing the same | — | 2019-09-10 |
| 9833973 | Metal laminate with polyimide resin and method for manufacturing the same | Sih-Ci Jheng, Chin-Te Yen | 2017-12-05 |
| 9521759 | Vertical conductive unit and manufacturing method thereof | — | 2016-12-13 |
| 9161452 | Component-embedded printed circuit board and method of forming the same | — | 2015-10-13 |
| 8801224 | LED illumination device | Yu-Tang Yen, Ching-Hao Chang, Bing-You Weng, Sunao Hsu, Yao Liu | 2014-08-12 |