Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812380 | Bumps bonds formed as metal line interconnects in a semiconductor device | Greg Dix, Harold Kline | 2017-11-07 |
| 8962397 | Multiple well drain engineering for HV MOS devices | Gregory Dix, Leighton E. McKeen, Ian Livingston, Rohan Braithwaite | 2015-02-24 |
| 8937351 | Power MOS transistor with improved metal contact | Gregory Dix, Harold Kline, Dan Grimm, Jacob Williams | 2015-01-20 |
| 8921986 | Insulated bump bonding | Gregory Dix | 2014-12-30 |