Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812380 | Bumps bonds formed as metal line interconnects in a semiconductor device | Greg Dix, Roger Melcher | 2017-11-07 |
| 8937351 | Power MOS transistor with improved metal contact | Gregory Dix, Dan Grimm, Roger Melcher, Jacob Williams | 2015-01-20 |
| 7226858 | Submicron contact fill using a CVD TiN barrier and high temperature PVD aluminum alloy deposition | Jacob Williams | 2007-06-05 |