PJ

Paul C. Lindsey, Jr.

MT Micro Processing Technology: 10 patents #1 of 6Top 20%
Motorola: 1 patents #6,475 of 12,470Top 55%
TS Toshiba Global Commerce Solutions: 1 patents #124 of 296Top 45%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #339,228 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12035009 Multimedia playback controlling system Phillip Monkowski, Andrew Norris, Dominic Lebron 2024-07-09
10056297 Modified plasma dicing process to improve back metal cleaving Darrell W. Foote 2018-08-21
9153493 System for separating devices from a semiconductor wafer 2015-10-06
8906745 Method using fluid pressure to remove back metal from semiconductor wafer scribe streets Darrell W. Foote 2014-12-09
8450188 Method of removing back metal from an etched semiconductor scribe street 2013-05-28
8445361 Method of dividing a semiconductor wafer having semiconductor and metal layers into separate devices 2013-05-21
8220685 System for breaking a semiconductor wafer or other workpiece along a scribe line Christopher Lindsey, Jeffery D. Atkinson 2012-07-17
7807479 Method and apparatus for improving force control in wafer scribing 2010-10-05
7415916 Scribing system with particle remover 2008-08-26
7392732 Scribing tool and method Christopher Lindsey, Jeffery D. Atkinson 2008-07-01
7165331 Apparatus and method for scribing a semiconductor wafer while controlling scribing forces Bradley Engel 2007-01-23
6826840 Semiconductor wafer scribing system Jeffery D. Atkinson 2004-12-07
6022807 Method for fabricating an integrated circuit Robert J. McClelland 2000-02-08
4264393 Reactor apparatus for plasma etching or deposition Georges J. Gorin 1981-04-28