Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10420509 | Sealed package and method of forming same | Craig L. Schmidt | 2019-09-24 |
| 10290757 | Power source and method of forming same | Andreas Fenner, Jennifer Lorenz Marckmann, James R. Wasson | 2019-05-14 |
| 10136535 | Hermetically-sealed packages including feedthrough assemblies | — | 2018-11-20 |
| 10124559 | Kinetically limited nano-scale diffusion bond structures and methods | Michael S. Sandlin, Raymond Miller Karam, Georges Roussos, Thomas Mikio Wynne | 2018-11-13 |
| 10098589 | Sealed package and method of forming same | Craig L. Schmidt | 2018-10-16 |
| 10096393 | Nuclear radiation particle power converter | Andreas Fenner, Anna J. Malin, Paul F. Gerrish, Bruce C. Fleischhauer, Larry E. Tyler | 2018-10-09 |
| 9968794 | Implantable medical device system including feedthrough assembly and method of forming same | Michael S. Sandlin | 2018-05-15 |
| 9913693 | Error correction techniques in surgical navigation | Randal C. Schulhauser, Paul F. Gerrish, Michael F. Mattes, Todd A. Kallmyer, Patrick P. Senarith +1 more | 2018-03-13 |
| 9865533 | Feedthrough assemblies | Michael S. Sandlin | 2018-01-09 |
| 9832867 | Embedded metallic structures in glass | John K. Day, Michael S. Sandlin | 2017-11-28 |
| 9688053 | Devices formed with techniques for bonding substrates using an intermediate layer | Michael S. Sandlin | 2017-06-27 |
| 9616223 | Media-exposed interconnects for transducers | Michael A. Schugt, Kamal Deep Mothilal, Lary R. Larson, Michael F. Mattes | 2017-04-11 |
| 9431312 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, Malcolm Grief | 2016-08-30 |
| 9318400 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, Malcolm Grief | 2016-04-19 |
| 9252415 | Power sources suitable for use in implantable medical devices and corresponding fabrication methods | Mohsen Askarinya, Andreas Fenner, Erik J. Herrmann, John K. Day | 2016-02-02 |
| 9171721 | Laser assisted direct bonding | Ralph B. Danzl, Michael S. Sandlin | 2015-10-27 |
| 9120287 | Techniques for bonding substrates using an intermediate layer | Michael S. Sandlin | 2015-09-01 |
| 8796109 | Techniques for bonding substrates using an intermediate layer | Michael S. Sandlin | 2014-08-05 |
| 8666505 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, Malcolm Grief | 2014-03-04 |
| 8461681 | Layered structure for corrosion resistant interconnect contacts | — | 2013-06-11 |
| 8433402 | Hermetic wafer-to-wafer bonding with electrical interconnection | Michael F. Mattes, Jonathan Smith | 2013-04-30 |
| 8424388 | Implantable capacitive pressure sensor apparatus and methods regarding same | Michael F. Mattes | 2013-04-23 |
| 8141556 | Metallization with tailorable coefficient of thermal expansion | — | 2012-03-27 |
| 7902851 | Hermeticity testing | Andreas Fenner, Geoffrey Batchelder, Paul F. Gerrish, Lary R. Larson, Anna J. Malin +2 more | 2011-03-08 |
| 7886608 | Pressure sensor configurations for implantable medical electrical leads | Kamal Deep Mothilal, Michael A. Schugt, Jonathan P. Roberts, Clark B. Norgaard, Lary R. Larson | 2011-02-15 |