Patents per Year
Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230598 | Semiconductor package | — | 2025-02-18 |
| 12205869 | Method for forming a semiconductor package | Chih-Feng Fan | 2025-01-21 |
| 11737351 | Organic semiconductor material and organic photoelectric device using the same | Chain-Shu Hsu, Jun-Yan Yu, Kuan-Lin Peng, Yi-Ming Chang, Chuang-Yi Liao +1 more | 2023-08-22 |
| 11562948 | Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor package | Chih-Feng Fan | 2023-01-24 |
| 11296006 | Circuit board and packaged chip | — | 2022-04-05 |
| 10622314 | Chip package structure | — | 2020-04-14 |
| 10559513 | Circuit board and packaged chip | — | 2020-02-11 |
| 9640475 | Chip packaging structure and manufacturing method thereof | Zhi Zhuang, Chih-An Yang | 2017-05-02 |