Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205869 | Method for forming a semiconductor package | You-Wei Lin | 2025-01-21 |
| 11562948 | Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor package | You-Wei Lin | 2023-01-24 |
| 9423187 | Plate type heat pipe with mesh wick structure having opening | — | 2016-08-23 |
| 7743818 | Heat exchange module | Tay-Jian Liu, Chih-Peng Lee, Chao-Nien Tung | 2010-06-29 |
| 7530385 | Rotary-type total heat exchanger | Tay-Jian Liu, Shun-Yuan Jan, Shang-Chih Liang | 2009-05-12 |