Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11975846 | Systems, methods, and apparatus for passive cooling of UAVs | Peng Wang, Jon James Anderson, Chinchuan Andrew Chiu | 2024-05-07 |
| 11437328 | Device thermal management | Peng Wang, Le Gao, Jorge Luis Rosales | 2022-09-06 |
| 11042174 | System and method for thermal management of a wearable computing device based on proximity to a user | Vivek Sahu, Jon James Anderson, Peng WANG, Shujuan Wang | 2021-06-22 |
| 10746474 | Multi-phase heat dissipating device comprising piezo structures | Jorge Luis Rosales, Le Gao, Jon James Anderson | 2020-08-18 |
| 10736245 | Electronic display assembly with combined conductive and convective cooling | William Dunn, Ware Bedell | 2020-08-04 |
| 10189554 | Enclosure cooling for thermal management of unmanned aerial vehicles | Peng Wang, Vivek Sahu, Shujuan Wang, Jon James Anderson, Chinchuan Andrew Chiu | 2019-01-29 |
| 10080316 | Electronic display assembly having thermal cooling plate and optional convective air cooling loop | William Dunn, Ware Bedell | 2018-09-18 |
| 9313917 | Thermal plate with optional cooling loop in electronic display | William Dunn, Ware Bedell | 2016-04-12 |
| 9313447 | Field serviceable electronic display | William Dunn, Ware Bedell, David Williams | 2016-04-12 |
| 9072166 | Field serviceable electronic display | William Dunn, Ware Bedell, David Williams | 2015-06-30 |
| 8612312 | Electronically managing items in a wish list | Matthew M. Edwards, Nitin Bansal, Jacob D. Cohen, Jeffrey Hsu | 2013-12-17 |
| 8497972 | Thermal plate with optional cooling loop in electronic display | William Dunn, Ware Bedell | 2013-07-30 |
| 8310824 | Field serviceable electronic display | William Dunn, Ware Bedell, David Williams | 2012-11-13 |
| 7969733 | Heat transfer system, method, and computer program product for use with multiple circuit board environments | Samuel Abbay, Jeong Hun Kim | 2011-06-28 |
| 7965506 | Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder | Zhihai Zack Yu | 2011-06-21 |
| 7885062 | Computer chassis with partitions for improved airflow | Barry A. Wagner, William P. Tsu | 2011-02-08 |
| 7359205 | Bottom exit of exhaust air from a chassis to reduce acoustics emission | Xiaohua Sun | 2008-04-15 |