PM

Paul Menkin

MA Mannkind: 12 patents #23 of 146Top 20%
OL Olin: 3 patents #231 of 783Top 30%
EN Enthone-Omi: 2 patents #6 of 42Top 15%
Overall (All Time): #265,998 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12383552 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell, John J. Freeman 2025-08-12
11607410 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell, John J. Freeman 2023-03-21
11433135 High capacity diketopiperazine microparticles and methods Marshall L. Grant, Grayson W. Stowell 2022-09-06
10772883 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell, John J. Freeman 2020-09-15
10603383 High capacity diketopiperazine microparticles and methods Marshall L. Grant, Grayson W. Stowell 2020-03-31
10376587 High capacity diketopiperazine microparticles and methods Marshall L. Grant, Grayson W. Stowell 2019-08-13
10130709 High capacity diketopiperazine microparticles and methods Marshall L. Grant, Grayson W. Stowell 2018-11-20
9630930 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell 2017-04-25
9364436 High capacity diketopiperazine microparticles and methods Marshall L. Grant, Grayson W. Stowell 2016-06-14
8778403 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell 2014-07-15
8734845 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell 2014-05-27
8551528 Diketopiperazine microparticles with defined specific surface areas Marshall L. Grant, Grayson W. Stowell 2013-10-08
5998237 Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion Jay B. Conrod, Van K. Chiem 1999-12-07
5368718 Electrowinning of direct metallization accelerators Jay B. Conrod, Durand A. Cercone 1994-11-29
5181770 Surface topography optimization through control of chloride concentration in electroformed copper foil Andrew J. Brock, Lifun Lin, Ned W. Polan 1993-01-26
5071520 Method of treating metal foil to improve peel strength Lifun Lin 1991-12-10
4956053 Apparatus and process for the production of micro-pore free high ductility metal foil Ned W. Polan, Raymond J. Smialek 1990-09-11