Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5998237 | Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion | Van K. Chiem, Paul Menkin | 1999-12-07 |
| 5376248 | Direct metallization process | Gary R. Sutcliffe | 1994-12-27 |
| 5368718 | Electrowinning of direct metallization accelerators | Paul Menkin, Durand A. Cercone | 1994-11-29 |
| 5358602 | Method for manufacture of printed circuit boards | Gary R. Sutcliffe | 1994-10-25 |