Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5545510 | Photodefinable dielectric composition useful in the manufacture of printed circuits | Peter D. GABRIELE, Raymond A. Letize, William R. Adams | 1996-08-13 |
| 5376189 | Composition and process for treatment of metallic surfaces | — | 1994-12-27 |
| 5213840 | Method for improving adhesion to polymide surfaces | Richard C. Retallick, Raymond A. Letize | 1993-05-25 |
| 5132038 | Composition for preparing printed circuit through-holes for metallization | Joseph J. D'Ambrisi, John J. Kuzmik | 1992-07-21 |
| 5077099 | Electroless copper plating process and apparatus | Edward Donlon | 1991-12-31 |
| 5037482 | Composition and method for improving adhesion of coatings to copper surfaces | Barry H. Williams, Thomas J. Carmody | 1991-08-06 |
| 5032427 | Process for preparation printed circuit through-holes for metallization | Joseph J. D'Ambrisi, John J. Kuzmik | 1991-07-16 |
| 4976990 | Process for metallizing non-conductive substrates | Wolf Bach, Donald Ferrier, Ann S. Williams, Mary J. Senechal | 1990-12-11 |
| 4938853 | Electrolytic method for the dissolution of copper particles formed during electroless copper deposition | Richard C. Retallick | 1990-07-03 |
| 4931148 | Method for manufacture of printed circuit boards | Harold L. Rhodenizer | 1990-06-05 |
| 4921571 | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces | Bryan Whitmore | 1990-05-01 |
| 4756930 | Process for preparing printed circuit board thru-holes | Harold L. Rhodenizer | 1988-07-12 |
| 4735694 | Method for manufacture of printed circuit boards | — | 1988-04-05 |
| 4608275 | Oxidizing accelerator | John Grunwald, David Sawoska | 1986-08-26 |
| 4597988 | Process for preparing printed circuit board thru-holes | Harold L. Rhodenizer | 1986-07-01 |
| 4459184 | Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential | — | 1984-07-10 |
| 4279948 | Electroless copper deposition solution using a hypophosphite reducing agent | John Grunwald, Donald Ferrier, David Sawoska | 1981-07-21 |
| 4265943 | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions | Rachel Goldstein, John Grunwald | 1981-05-05 |
| 4209331 | Electroless copper composition solution using a hypophosphite reducing agent | John Grunwald, Donald Ferrier, David Sawoska | 1980-06-24 |