| 10838156 |
Integrated assembly package mounting clip |
Michael Robert Johnson, Paul A. Cushion, Paul Hogan, Dave G. Persad |
2020-11-17 |
| 10290788 |
Systems and methods for managing heat from an LED |
Jay Liu |
2019-05-14 |
| 9627582 |
Light-emitting diode architectures for enhanced performance |
Donald L. McDaniel, Michael Lim, Michael Gregory Brown, Scott W. Duncan, Andrei Kazmierski |
2017-04-18 |
| D777121 |
LED package |
Scott W. Duncan, Donald L. McDaniel |
2017-01-24 |
| 9431582 |
Packaging method and system for LEDs |
Michael Lim, Aaron Breen, Michael Hadley |
2016-08-30 |
| D686581 |
LED package |
Michael Lim, Aaron Breen, Michael Hadley |
2013-07-23 |
| 8362703 |
Light-emitting devices |
Rashmi Kumar, Robert F. Karlicek, Jr. |
2013-01-29 |
| D624029 |
LED package |
Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza +1 more |
2010-09-21 |
| D623609 |
LED package |
Christian Hoepfner, Georgia Chmielewski |
2010-09-14 |
| D623608 |
LED package |
Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza +1 more |
2010-09-14 |
| D622663 |
Connector for LED package |
Christian Hoepfner, Georgia Chmielewski |
2010-08-31 |
| D617289 |
LED package |
Christian Hoepfner, Georgia Chmielewski |
2010-06-08 |
| 7692207 |
Packaging designs for LEDs |
Alexei A. Erchak, Robert F. Karlicek, Jr., Michael Lim, Elefterios Lidorikis, Jo A. Venezia +1 more |
2010-04-06 |
| D606021 |
LED package |
Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza +1 more |
2009-12-15 |
| D603352 |
LED package |
Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza +1 more |
2009-11-03 |
| D576968 |
LED package |
Christian Hoepfner, Georgia Chmielewski, John W. Graff, Robert F. Karlicek, Jr., Daniel Mendoza +1 more |
2008-09-16 |
| D574337 |
LED package |
Christian Hoepfner, Georgia Chmielewski |
2008-08-05 |
| 7251872 |
Method for forming a chip package |
Elie Awad |
2007-08-07 |
| 7170100 |
Packaging designs for LEDs |
Alexei A. Erchak, Robert F. Karlicek, Jr., Michael Lim, Elefterios Lidorikis, Jo A. Venezia +1 more |
2007-01-30 |
| 6815806 |
Asymmetric partially-etched leads for finer pitch semiconductor chip package |
Elie Awad |
2004-11-09 |
| 5289344 |
Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means |
Jay J. Gagnon |
1994-02-22 |
| 5012322 |
Semiconductor die and mounting assembly |
Paul A. Guillotte, Thomas J. Martiska, Jay J. Gagnon |
1991-04-30 |
