Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7255925 | Thermosetting resin composition for high speed transmission circuit board | Hyuk Sung Chung, Bong-Jin Jeon, Hyun Cheol KIM | 2007-08-14 |
| 5412028 | Thermoplastic resin composition | Jong K. Yeo, Suk K. Chang, Min Ho Lee | 1995-05-02 |