Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7255925 | Thermosetting resin composition for high speed transmission circuit board | Hyuk Sung Chung, Hyun Cheol KIM, Eun-Hae Koo | 2007-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7255925 | Thermosetting resin composition for high speed transmission circuit board | Hyuk Sung Chung, Hyun Cheol KIM, Eun-Hae Koo | 2007-08-14 |