Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174912 | Systems and methods for circular buffering control in a memory device | — | 2012-05-08 |
| 8176367 | Systems and methods for managing end of life in a solid state drive | David L. Dreifus, Brian McKean | 2012-05-08 |
| 8151137 | Systems and methods for governing the life cycle of a solid state drive | Brian McKean, David L. Dreifus | 2012-04-03 |
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinphuoc V. Hoang, Thomas E. Noll, Anil Agarwal, Matthew Sean Read, Anthony James LoBianco | 2011-12-06 |
| 8022490 | Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds | — | 2011-09-20 |
| 8024490 | Method and system for generic data transfer interface | — | 2011-09-20 |
| 8013440 | Enhanced thermal dissipation ball grid array package | — | 2011-09-06 |
| 7923842 | GaAs integrated circuit device and method of attaching same | Hong Shen, Ravi Ramanathan, Qiuliang Luo, Usama K Abdali | 2011-04-12 |
| 7679852 | Adjustment of read/write clock edge timing | Jimmie Ray Shaver | 2010-03-16 |
| 7635606 | Wafer level package with cavities for active devices | Gene Gan, Tony LoBianco | 2009-12-22 |
| 7629201 | Method for fabricating a wafer level package with device wafer and passive component integration | Qing-Cao Gan, Anthony James LoBianco, Steve Xin Liang | 2009-12-08 |
| 7613088 | Method and system for time based file storage | — | 2009-11-03 |
| 7576426 | Wafer level package including a device wafer integrated with a passive component | Qing-Cao Gan, Anthony James LoBianco, Steve Xin Liang | 2009-08-18 |
| 7549021 | Enhanced data integrity using parallel volatile and non-volatile transfer buffers | — | 2009-06-16 |
| 7471098 | Testing device and method for an integrated circuit | Paul Huelskamp | 2008-12-30 |
| 7328385 | Method and apparatus for measuring digital timing paths by setting a scan mode of sequential storage elements | Paul Huelskamp, Bradley Allen MacMonagle | 2008-02-05 |
| 7198987 | Overmolded semiconductor package with an integrated EMI and RFI shield | Suresh Jayaraman, Larry D. Pottebaum | 2007-04-03 |
| 7196644 | Decoupling of analog input and digital output | Kent D. Anderson, Gregory L. Silvus | 2007-03-27 |
| 7133228 | Using data compression to achieve lower linear bit densities on a storage medium | Kendall H. Fung, David G. Dalton | 2006-11-07 |
| 7126776 | Disk drive having a sector clock that is synchronized to the angular speed of the spindle motor | Mark David Hagen | 2006-10-24 |
| 6862151 | Method and apparatus for read error recovery | Edward Sean Hoskins, Steven S. Williams | 2005-03-01 |
| 6654195 | Disk drive having a register set for providing real time position variables to a host | Charles Frank, Thomas Hanan | 2003-11-25 |
| 6435883 | High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill | — | 2002-08-20 |
| 5951813 | Top of die chip-on-board encapsulation | — | 1999-09-14 |
| 5905639 | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds | — | 1999-05-18 |