Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426148 | Thermal management in circuit board assemblies | — | 2025-09-23 |
| 12357932 | Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereof | Randall M. Stoltenberg | 2025-07-15 |
| 12230596 | Electronics assemblies employing copper in multiple locations | — | 2025-02-18 |
| 12091567 | Ink composition, method for forming a conductive member, and conductive device | Zhenggang Li, Yeng Ming Lam, Chee Lip Gan, Jaewon Kim | 2024-09-17 |
| 12016118 | Ceramic-based circuit board assemblies formed using metal nanoparticles | Khanh Nguyen | 2024-06-18 |
| 11910520 | Thermal management in circuit board assemblies | — | 2024-02-20 |
| 11735548 | Electronics assemblies employing copper in multiple locations | — | 2023-08-22 |
| 11503700 | Thermal management in circuit board assemblies | — | 2022-11-15 |
| 11417441 | Method of interconnecting nanowires, nanowire network and transparent conductive electrode | Byung Hoon Lee, Chee Lip Gan, Yeng Ming Lam | 2022-08-16 |
| 11274224 | Ink composition, method for forming a conductive member, and conductive device | Zhenggang Li, Yeng Ming Lam, Chee Lip Gan, Jaewon Kim | 2022-03-15 |
| 11141785 | Metal nanoparticles formed around a nucleus and scalable processes for producing same | — | 2021-10-12 |
| 11031704 | Cable with nanoparticle paste | Randall M. Stoltenberg | 2021-06-08 |
| 10919281 | Nanoparticle application with adhesives for printable electronics | Randall M. Stoltenberg | 2021-02-16 |
| 10695872 | Heat spreaders fabricated from metal nanoparticles | Jyotsna Iyer, Ike C. Hsu | 2020-06-30 |
| 10701804 | Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas | — | 2020-06-30 |
| 10692621 | Method of interconnecting nanowires and transparent conductive electrode | Byung Hoon Lee, Chee Lip Gan, Yeng Ming Lam | 2020-06-23 |
| 10616994 | Thermal management in circuit board assemblies | — | 2020-04-07 |
| 10569329 | Metal nanoparticles formed around a nucleus and scalable processes for producing same | — | 2020-02-25 |
| 10544483 | Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same | Randall M. Stoltenberg | 2020-01-28 |
| 10357943 | Articles having an exposed surface coating formed from copper nanoparticles | — | 2019-07-23 |
| 10283482 | Wire bonding methods and systems incorporating metal nanoparticles | Randall M. Stoltenberg | 2019-05-07 |
| 10202512 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng | 2019-02-12 |
| 9976042 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng | 2018-05-22 |
| 9881895 | Wire bonding methods and systems incorporating metal nanoparticles | Randall M. Stoltenberg | 2018-01-30 |
| 9797032 | Articles containing copper nanoparticles and methods for production and use thereof | Peter V. Bedworth | 2017-10-24 |