CG

Chee Lip Gan

KU Kuprion: 4 patents #2 of 8Top 25%
NU Nanyang Technological University: 2 patents #168 of 1,285Top 15%
LM Lockheed Martin: 2 patents #1,600 of 6,507Top 25%
MIT: 1 patents #4,386 of 9,367Top 50%
Overall (All Time): #698,155 of 4,157,543Top 20%
7
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12091567 Ink composition, method for forming a conductive member, and conductive device Zhenggang Li, Yeng Ming Lam, Jaewon Kim, Alfred A. Zinn 2024-09-17
11417441 Method of interconnecting nanowires, nanowire network and transparent conductive electrode Byung Hoon Lee, Yeng Ming Lam, Alfred A. Zinn 2022-08-16
11274224 Ink composition, method for forming a conductive member, and conductive device Zhenggang Li, Yeng Ming Lam, Jaewon Kim, Alfred A. Zinn 2022-03-15
10696599 Shape memory ceramic particles and structures formed thereof Zehui Du, Hang Yu, Christopher A. Schuh 2020-06-30
10692621 Method of interconnecting nanowires and transparent conductive electrode Byung Hoon Lee, Yeng Ming Lam, Alfred A. Zinn 2020-06-23
10202512 Conductive paste, method for forming an interconnection and electrical device Byung Hoon Lee, Mei Zhen Ng, Alfred A. Zinn 2019-02-12
9976042 Conductive paste, method for forming an interconnection and electrical device Byung Hoon Lee, Mei Zhen Ng, Alfred A. Zinn 2018-05-22