Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401005 | Optoelectronic package structure and photo-interrupting device | Shirley Sia | 2025-08-26 |
| 12347736 | Light emitting device | Wen-Hsiang Lin, Chung-Hsien Yu | 2025-07-01 |
| 12310158 | Optoelectronic package structure | BO-JHIH CHEN, Chien-Shun Huang | 2025-05-20 |
| 12183724 | Multiple pixel package structure with buried chip and electronic device using the same | Tsung-Kang Ying, ERH-CHAN HSU | 2024-12-31 |
| 12009459 | Light-emitting device, light-emitting assembly, and integrated circuit flip-chip | Min Chen | 2024-06-11 |
| 11959606 | Package structure with supporting frame | CHENG-YING LEE, Ming-Sung Tsai | 2024-04-16 |
| 11774691 | Light emitting module and light-emitting device having the same | Cheng-Han Wang, Szu-Tsung Kao, Chih-Li Yu, Cheng-Hong Su, Chun-Wei Huang | 2023-10-03 |
| 11670739 | LED package sturcture | Hao-Wei Hong, Tsung-Kang Ying | 2023-06-06 |
| 11508703 | Light emitting device for monitoring system | Yu-Yu Chang, Chien-Shun Huang | 2022-11-22 |
| 11456405 | Chip bonding region of a carrier of light emitting package and manufacturing method thereof | Chih-Yuan Chen | 2022-09-27 |
| 11437355 | Light-emitting package structure and manufacturing method thereof | Chien-Feng Kao, Wen-Hsiang Lin | 2022-09-06 |
| 11307085 | Light detecting device, lighting module, and manufacturing method for the same | Wen-Hsiang Lin, Yung-Chang Jen, Shih-Chung Huang | 2022-04-19 |
| 11296064 | Substrate structure with buried chip and light emitting device using the same | Tsung-Kang Ying, ERH-CHAN HSU | 2022-04-05 |
| 11209146 | Miniaturized structured light projection module | Yu-Yu Chang, Yung-Chang Jen | 2021-12-28 |
| 11211313 | Lead frame array for carrying chips and LED package structure with multiple chips | Ming-Kun Weng | 2021-12-28 |
| 11145777 | Optical sensor module, method for manufacturing the same and frame structure thereof | Shih-Chung Huang, BO-JHIH CHEN | 2021-10-12 |
| 11139420 | LED package structure | Wen-Hsiang Lin, Chung-Hsien Yu | 2021-10-05 |
| 10990511 | Apparatus and application interface traversing method | Xiaoxia Chen, Yongde Huang | 2021-04-27 |
| 10879443 | LED package structure, chip carrier, and method for manufacturing chip carrier | Yu-Yu Chang | 2020-12-29 |
| 10777723 | LED package structure, heat-dissipating substrate, method for manufacturing LED package structure, and method for manufacturing heat-dissipating substrate | — | 2020-09-15 |
| 10727383 | LED package structure | Yu-Yu Chang, Shih-Chiang Yen, Yi-Hsuan Chen | 2020-07-28 |
| 10690538 | Optical sensor module and a wearable device including the same | — | 2020-06-23 |
| 10686096 | Optical sensor module and a wearable device including the same | Tsan-Yu Ho, Meng-Sung Chou | 2020-06-16 |
| 10658556 | LED package structure and multilayer circuit board | Tsung-Kang Ying, Pin-Feng Hung | 2020-05-19 |
| 10655828 | LED package structure | Ming-Kun Weng | 2020-05-19 |