Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183724 | Multiple pixel package structure with buried chip and electronic device using the same | Chen-Hsiu Lin, Tsung-Kang Ying | 2024-12-31 |
| 11296064 | Substrate structure with buried chip and light emitting device using the same | Chen-Hsiu Lin, Tsung-Kang Ying | 2022-04-05 |
| 9202805 | LED package structure including dark-colored and light-transmissible encapsulant | Hou-Te Lee, Tsung-Kang Ying | 2015-12-01 |