Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8101527 | Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same | Joon-Mo Seo, Hyuk Soo Moon, Cheol Jong Han, Jong Geol Lee | 2012-01-24 |
| 7968977 | Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same | Joon-Mo Seo, Hyuk Soo Moon, Cheol Jong Han, Jong Geol Lee | 2011-06-28 |
| 7768141 | Dicing die attachment film and method for packaging semiconductor using same | Joon-Mo Seo, Byoung-Un Kang, Jae Hoon Kim, Tae Hyun Sung, Soon Young Hyun +2 more | 2010-08-03 |
| 7485494 | Dicing die adhesive film for semiconductor | Byoung-Un Kang, Jai Hoon Kim, Joon-Mo Seo, Tae Hyun Sung, Dong Cheon Shin | 2009-02-03 |