Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768141 | Dicing die attachment film and method for packaging semiconductor using same | Joon-Mo Seo, Kyung-Tae Wi, Jae Hoon Kim, Tae Hyun Sung, Soon Young Hyun +2 more | 2010-08-03 |
| 7553701 | Semiconductor packaging method | Joon-Mo Seo, Jae Hoon Kim, Soon Young Hyun, Ji Eun Kim, Jun-Woo Lee +1 more | 2009-06-30 |
| 7485494 | Dicing die adhesive film for semiconductor | Jai Hoon Kim, Joon-Mo Seo, Tae Hyun Sung, Dong Cheon Shin, Kyung-Tae Wi | 2009-02-03 |
| 7408015 | Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adduct | Hyuk Soo Moon, Jong Kul Lee, Kyoung Tae WI, Tae-Sung Kim | 2008-08-05 |
| 7105625 | Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same | Hyuk Soo Moon, Jong Kul Lee, Kyoung Tae WI, Tae-Sung Kim | 2006-09-12 |
| 6878261 | Surface treatment method of copper foil with silane coupling agent | Sang Kyum Kim, Chang Hee Choi | 2005-04-12 |