JK

Jun-Hyuk Kwon

LH Lg Hausys: 4 patents #84 of 377Top 25%
TC Tyco Electronics Amp Korea Co.: 1 patents #36 of 111Top 35%
📍 Gunpo-si, KR: #153 of 683 inventorsTop 25%
Overall (All Time): #976,623 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
10840642 Connector assembly and method of manufacturing socket for connector assembly Gi-Chan Kwon, Sung Jun Choi, Hoon Kim, Jong Jun Lee 2020-11-17
9657482 Floor panel having adhesive applied sheet Hae Seung Ko, Sang Sun Park 2017-05-23
9623635 Chip through flooring material using PLA resin Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Chang Won Kang, Hyun-Jong Kwon +3 more 2017-04-18
9517612 Floor material using PLA resin Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Chang Won Kang, Hyun-Jong Kwon +3 more 2016-12-13
9422729 Chip-inlaid flooring material using PLA resin Hyun-Jong Kwon, Ji-Young Kim, Ki Bong Park, Chang Won Kang, Sang Sun Park +3 more 2016-08-23