Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9623635 | Chip through flooring material using PLA resin | Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Chang Won Kang, Jun-Hyuk Kwon +3 more | 2017-04-18 |
| 9517612 | Floor material using PLA resin | Cheng Zhe Huang, Ji-Young Kim, Ki Bong Park, Chang Won Kang, Jun-Hyuk Kwon +3 more | 2016-12-13 |
| 9422729 | Chip-inlaid flooring material using PLA resin | Ji-Young Kim, Ki Bong Park, Chang Won Kang, Jun-Hyuk Kwon, Sang Sun Park +3 more | 2016-08-23 |