Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6870438 | Multi-layered wiring board for slot coupling a transmission line to a waveguide | Shinichi Koriyama, Kenji Kitazawa, Hidehiro Minamiue | 2005-03-22 |
| 6642808 | High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic | Shinichi Koriyama, Kenji Kitazawa, Hidehiro Minamiue | 2003-11-04 |
| 6356173 | High-frequency module coupled via aperture in a ground plane | Koichi Nagata, Kenji Kitazawa, Shinichi Koriyama, Shigeki Morioka, Takanori Kubo +3 more | 2002-03-12 |