Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6356173 | High-frequency module coupled via aperture in a ground plane | Koichi Nagata, Kenji Kitazawa, Shinichi Koriyama, Takanori Kubo, Hidehiro Minamiue +3 more | 2002-03-12 |
| 6057600 | Structure for mounting a high-frequency package | Kenji Kitazawa, Shinichi Koriyama, Satoru Tomie | 2000-05-02 |