Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11994440 | High temperature protected wire bonded sensors | Alexander A. Ned, Leo Geras | 2024-05-28 |
| 11359985 | Oil filled transducers with isolated compensating capsule | Alexander A. Ned, Andrew Bemis, Scott Goodman | 2022-06-14 |
| 10871415 | High temperature protected wire bonded sensors | Alexander A. Ned, Leo Geras | 2020-12-22 |
| 10825719 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Alexander A. Ned, Joseph R. VanDeWeert | 2020-11-03 |
| 10605685 | High-temperature headers for sensing elements | Alexander A. Ned, Scott Goodman | 2020-03-31 |
| 10436662 | High temperature protected wire bonded sensors | Alexander A. Ned, Leo Geras | 2019-10-08 |
| 10256138 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Alexander A. Ned, Joseph R. VanDeWeert | 2019-04-09 |
| 10153242 | Electronic device interconnections for high temperature operability | — | 2018-12-11 |
| 10132705 | Low-stress floating-chip pressure sensors | Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis | 2018-11-20 |
| 10126195 | High-temperature headers with ribbed components for stress-relieved hermetic sealing | Alexander A. Ned | 2018-11-13 |
| 10119877 | High-temperature headers for sensing elements | Alexander A. Ned, Scott Goodman | 2018-11-06 |
| 9917067 | Electronic device interconnections for high temperature operability | — | 2018-03-13 |
| 9721832 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Alexander A. Ned, Joseph R. VanDeWeert | 2017-08-01 |
| 9322730 | Sensor co-located with an electronic circuit | Alexander A. Ned, Louis DeRosa, Joseph R. VanDeWeert | 2016-04-26 |
| 8631707 | Differential temperature and acceleration compensated pressure transducer | Anthony D. Kurtz, Alexander A. Ned, Nora Kurtz | 2014-01-21 |