Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12259289 | Sensor header assembly for increased reliability in high-pressure environments | Scott Goodman | 2025-03-25 |
| 11994440 | High temperature protected wire bonded sensors | Leo Geras, Sorin Stefanescu | 2024-05-28 |
| 11802804 | Sensor header assembly for increased reliability in high-pressure environments | Scott Goodman | 2023-10-31 |
| 11467049 | Sensor header assembly for increased reliability in high-pressure environments | Scott Goodman | 2022-10-11 |
| 11359985 | Oil filled transducers with isolated compensating capsule | Sorin Stefanescu, Andrew Bemis, Scott Goodman | 2022-06-14 |
| 10871415 | High temperature protected wire bonded sensors | Leo Geras, Sorin Stefanescu | 2020-12-22 |
| 10825719 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Sorin Stefanescu, Joseph R. VanDeWeert | 2020-11-03 |
| 10788386 | Sensor header assembly for increased reliability in high-pressure environments | Scott Goodman | 2020-09-29 |
| 10605685 | High-temperature headers for sensing elements | Sorin Stefanescu, Scott Goodman | 2020-03-31 |
| 10436662 | High temperature protected wire bonded sensors | Leo Geras, Sorin Stefanescu | 2019-10-08 |
| 10256138 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Sorin Stefanescu, Joseph R. VanDeWeert | 2019-04-09 |
| 10132705 | Low-stress floating-chip pressure sensors | Sorin Stefanescu, Joseph R. VanDeWeert, Andrew Bemis | 2018-11-20 |
| 10126195 | High-temperature headers with ribbed components for stress-relieved hermetic sealing | Sorin Stefanescu | 2018-11-13 |
| 10119877 | High-temperature headers for sensing elements | Sorin Stefanescu, Scott Goodman | 2018-11-06 |
| 10048139 | Pressure transducer structures suitable for curved surfaces | Anthony D. Kurtz, Scott Goodman | 2018-08-14 |
| 9915578 | High temperature transducer using SOI, silicon carbide or gallium nitride electronics | Anthony D. Kurtz, Wolf S. Landmann, Joseph R. VanDeWeert | 2018-03-13 |
| 9791342 | Combination static and dynamic pressure transducer employing a micro-filter | Adam Hurst, Joseph R. VanDeWeert | 2017-10-17 |
| 9739680 | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments | Joseph R. VanDeWeert, Leo Geras | 2017-08-22 |
| 9721832 | Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding | Sorin Stefanescu, Joseph R. VanDeWeert | 2017-08-01 |
| 9574960 | Ultra-miniature multi-hole flow angle probes | Tonghuo Shang, Scott Goodman, Steve Carter, Joseph R. VanDeWeert | 2017-02-21 |
| 9513181 | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments | Joseph R. VanDeWeert, Leo Geras | 2016-12-06 |
| 9322730 | Sensor co-located with an electronic circuit | Sorin Stefanescu, Louis DeRosa, Joseph R. VanDeWeert | 2016-04-26 |
| 9250145 | Pressure transducer utilizing non-lead containing frit | Anthony D. Kurtz | 2016-02-02 |
| 9127993 | High temperature, high bandwidth pressure acquisition system | Anthony D. Kurtz, Joseph R. VanDeWeert | 2015-09-08 |
| 9105752 | High temperature transducer using SOI, silicon carbide or gallium nitride electronics | Anthony D. Kurtz, Wolf S. Landmann, Joseph R. VanDeWeert | 2015-08-11 |