Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5740953 | Method and apparatus for cleaving semiconductor wafers | Colin Smith, Kalman Kaufman, Isaac Mazor, Elik Chen | 1998-04-21 |
| 4444349 | Wire bonding apparatus | Glenn B. Bilane, Lawrence M. Rubin, Albert Soffa | 1984-04-24 |
| 4437604 | Method of making fine wire interconnections | Ely Razon | 1984-03-20 |
| 4422568 | Method of making constant bonding wire tail lengths | Richard J. Elles, Razon Ely | 1983-12-27 |
| 4340166 | High speed wire bonding method | Glenn B. Bilane, Lawrence M. Rubin, Albert Soffa | 1982-07-20 |
| 4266710 | Wire bonding apparatus | Glenn B. Bilane, Lawrence M. Rubin, Albert Soffa | 1981-05-12 |
| 4202482 | Solenoid actuated wire feed and tearing apparatus | Moshe E. Sade, Albert Soffa, WILLIAM WING | 1980-05-13 |