Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400412 | Method for modifying design on basis of additive cross-section outline for 3D printing | Hye In Lee, Hwa Seon Shin, Sung Hun Park | 2025-08-26 |
| 12350886 | 3D printing slicing method for solving quantization error problem | Hwa Seon Shin, Hye In Lee, Sung Hun Park, Ji Min Jang | 2025-07-08 |
| 12233601 | Method for creating 2D slicing polyline based support structure for 3D printing | Hwa Seon Shin, Hye In Lee, Sung Hun Park | 2025-02-25 |
| 12220921 | Nozzle clogging defect compensating method for binder jetting stack manufacturing means | Hwa Seon Shin, Sung Hun Park, Hye In Lee, Jin Min Jang | 2025-02-11 |
| 12202206 | 3D printing slicing method for solving tolerance problem | Hwa Seon Shin, Hye In Lee, Sung Hun Park | 2025-01-21 |
| 11798231 | Method for generating hollow structure based on 2D laminated cross-sectional outline for 3D printing | Hye In Lee, Hwa Seon Shin, Sung Hun Park, Ji Min Jang | 2023-10-24 |
| 11613082 | Method for producing 3D mesh surface characteristic-based support for laminate manufacturing | Hwa Seon Shin, Hye In Lee, Ji Min Jang, Sung Hun Park | 2023-03-28 |
| 11548227 | Method for monitoring 3D printing equipped with 3D printing slicer and recursive loop structure | Hwa Seon Shin, Hye In Lee | 2023-01-10 |