YH

Young-Taik Hong

KAIST: 13 patents #992 of 11,619Top 9%
CI Cheil Industries: 1 patents #604 of 975Top 65%
Overall (All Time): #380,522 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
9975995 Ion conducting polymer comprising partially branched block copolymer and use thereof Jang Yong Lee, Tae Ho Kim, Duk Man Yu, Seog Je Kim 2018-05-22
9540319 Method for purifying sulfonated aromatic monomer Seog Je Kim, Ji Young Park, Dong Hyun Lee 2017-01-10
9325023 Method for manufacturing membrane-electrode assembly for polymer electrolyte fuel cell and membrane-electrode assembly manufactured thereby Tae Ho Kim, Young-Jun Yoon, Kyung Seok Yoon, Duk Man Yu 2016-04-26
8419918 Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby Hyung Dae Kang, Seog Je Kim, Jae-heung Lee 2013-04-16
7803460 Filament bundle type nano fiber and manufacturing method thereof Jae-Rock Lee, Seung-Yong Jee, Hyo Joong Kim, Seok Won Kim, Soo-Jin Park 2010-09-28
6433184 Polyamide-imide having head-to-tail backbone Kil-Yeong Choi, Jae-heung Lee, Moon-Young Jin, Kyoung Su CHOI, Ho-Jin Park 2002-08-13
6018055 Polyarylether containing N-substituted imide groups and process for producing the same Kil-Yeong Choi, Dong-Hack Suh, Eun-Young Chung 2000-01-25
5955568 Process for preparing polyamideimide resins by direct polymerization Kil-Yeong Choi, Dong-Hack Suh, Mi-Hie Yi, Moon-Young Jin 1999-09-21
5919942 Cyclohexane-1,2,4,5-diimide derivative and process for preparing the same Kil-Yeong Choi, Dong-Hack Suh, Sang Hyun Park 1999-07-06
5824766 Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them Kil-Yeong Choi, Mi-Hie Yi, Moon-Young Jin 1998-10-20
5569738 Melt processable etherimideimide/etherimide copolymer Kil-Yeong Choi, Jong Chan Won, Sang-Sun Woo, Youn S. Don 1996-10-29
5532334 Process for preparing polyamideimide resins having high molecular weight Kil-Yeong Choi, Dong-Hack Suh, Mi-Hie Yi, Jong Chan Won 1996-07-02
5521276 Polyamideimide resins containing isophorone diamine structures Kil-Yeong Choi, Mi-Hie Yi, Jae-heung Lee, Moon-Young Jin 1996-05-28